Call for Papers

Prospective authors are kindly invited to submit formatted 2-page abstracts, including results, figures, tables, and references. All submissions will undergo peer review and be evaluated based on originality, technical soundness, and clarity.

Important milestones:
Submission Deadline: July 31, 2026
Notification of Acceptance: Sept. 15, 2026
Early-Bird Registration Deadline: Sept. 30, 2026

Submission template:
Please prepare your abstract using the official IEDMS 2026 submission template.

Paper template download:
MS Word: Template Download Word template icon

Online Submission  

Requirements
  • Formatted 2-page abstract
  • Include results, figures, tables, and references
  • Peer-review evaluation
  • Originality, technical soundness, and clarity
  • Electron devices and materials related topics

Topics of Interest

The Technical Program Committee invites submissions in, but not limited to, the following areas:

A. Emerging Devices, Logic, and Memory Technologies

Novel processes and devices (Si, SiGe, Ge, 2D) for low power logic, memories, and associated characterization, modeling, simulation and reliability

B. High-Frequency and Power Devices, and Compound Semiconductor Technologies

Material growth, high-speed devices/circuits, power devices/circuits, associated characterization, modeling, simulation and reliability

C. Novel Materials, MEMS, Sensors, and Bio Technologies

Material preparation, thin-film transistors, energy-conversion devices, solar cells, spintronics, MEMS, sensor and thermoelectric devices, associated characterization, modeling, simulation, and reliability

D. Photonic Devices and Heterogeneous Integration Technologies

Lasers, light-emitting diodes, photodetectors, organic electronics, waveguides, Si-photonics, integration, and 3D ICs



Organizers｜
The Electronics Devices and Materials Association
National Taiwan University
Taiwan Semiconductor Research Institute

Advisor｜
Sponsors